Detailed Product Description

Application : 1. Bonding of ACF onto TAB, FPC, LCD, or PCB 2. Soldering of FPC or FFC to PCB 3. Bonding of cell phones, electronic translators, PDA, digital cameras, * computer monitors, and LCD modules Features : 1. The distinctive configuration of 180?? rotary platform provides smooth and steady process. It enhances efficiency by diminishing the idle time of operators. 2. The advance technology of programmed stepping temperature system enables fast temperature accelerating and maintaining . 3. Machine body made by Titanium Alloy, solid and modest. Specification : - Dimension: 480x600x580 (mm) - Max. size of bonding blade: 65 x 2.5 (mm) - Cylinder size: Dia.32 x 75 (mm) - Temperature range: Room temperature to 400 degree celsius (stepping) - Timer range: 0.1s ~ 999hrs - Heat up time: 100 - 300 degree celsius 5 s - Cool down time: 300 - 100 degree celsius 4 s - Pressure range: 0.15 ~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V / 110V 2500W - Max. size of bond objects: 120x120mm - Options: Monochrome CCD Camera System (CCD camera + Lens + Monitors) - Weight: 100KG