Detailed Product Description

Application : 1. Bonding of ACF onto TAB, FPC, LCD, or PCB 2. Soldering of FPC or FFC to PCB 3. Bonding of cell phones, electronic translators, PDA, digital cameras, * computer monitors, and LCD modules Features : 1. Precise configuration enhance quality of bonding 2. Flat Bed with advanced technology design of automatic sliding in-out function which providing smooth and accurate bonding condition. 3. The advance programmed stepping temperature system enable fast temperature accelerating and maintaining. 4. Ecology deign of facilities to enhance labors concern . 5. The High resolution look-up style CCD camera system enables to visualize and bonding of fine pitch products. 6. With vacuum system for fixing devices. Specification : - Dimension: 1000x870x1380 (mm) - Max. size of bonding blade: 65 x 2.5 (mm) - Cylinder size: Dia.32 x 75 (mm) - Temperature range: Room temperature to 400 degree celsius (stepping) - Timer range: 0.1s ~ 999hrs - Heat up time: 100 -300 degree celsius 5 s - Cool down time: 300 -100 degree celsius 4 s - Pressure range: 0.15 ~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V / 110V 2500W - Weight: 300KG