Detailed Product Description

Application : 1. Bonding of ACF onto TAB, FPC, LCD, or PCB 2. Soldering of FPC or FFC to PCB 3. Bonding of cell phones, electronic translators, PDA, digital cameras, * computer monitors, and LCD modules. Features : 1. Double Head, double platform provides high efficiency which equal to 1 labor operates 2 machines at the same time. 2. Double flat Bed with advanced technology design of automatic sliding in-out function which providing smooth and accurate bonding condition. 3. Precise configuration enhance quality of bonding. 4. The advance programmed stepping temperature system enable fast temperature accelerating and maintaining. 5. The 2 sets high resolution CCD camera system with 110~260X multiples and 14" monitors enables to visualize and bonding of fine pitch products . 6. With vacuum system for fixing devices Specification : - Dimension: 1000x870x1400 (mm) - Max. size of bonding blade: 65 x 2.5 (mm) - Cylinder size: Dia.32 x 75 (mm) - Temperature range: Room temperature to 400 degree celsius (stepping) - Timer range: 0.1s ~ 999hrs - Heat up time: 100 - 300 degree celsius 5 s - Cool down time: 300 - 100 degree celsius 4 s - Pressure range: 0.15 ~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V / 110V 5200W - Max. size of devices can bond: 127mm X 127mm - Weight: 250KG