Detailed Product Description

Application : 1. Bonding of ACF onto TAB, FPC, LCD, or PCB 2. Soldering of FPC or FFC to PCB 3. Repair of LCD modules size up to 14" Features : 1. The advanced technology design of automatic sliding in-out function which providing smooth and accurate bonding condition. 2. Precise configuration enhance quality of bonding 3. The advance programmed stepping temperature system enable fast temperature accelerating and maintaining. 4. The 2 sets high resolution CCD camera system with 110~260X multiples and 14" monitors enables to visualize and bonding of fine pitch products. 5. With vacuum system for fixing devices 6. Made by Aluminum Alloy. Solid and Modest Specification : - Dimension: 480 x 600 x 520 (mm) - Max. size of bonding blade: 65 x 2.5 (mm) - Cylinder size: Dia.32 x 75(mm) - Temperature range: Room temperature to 400 degree celsius (stepping) - Timer range: 0.1s ~ 999hrs - Heat up time: 100 - 300 degree celsius 5 s - Cool down time: 300 - 100 degree celsius 4 s - Pressure range: 0.15 ~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V / 110V 2000W - Max. size of devices can bond: 215mm X 285mm - Weight: 90KG