Detailed Product Description

Air compressor type Impulse Bonding Machine (For ACF bonding) Application : 1. Bonding of ACF onto TAB, FPC, LCD, or PCB 2. Soldering of FPC or FFC to PCB 3. Bonding of cell phones, electronic translators, PDA, digital cameras, * computer monitors, and LCD modules. Features : 1. The advanced technology design of automatic sliding in-out function which providing smooth and accurate bonding condition. 2. Precise configuration enhance quality of bonding 3. The advance programmed stepping temperature system enable fast temperature accelerating and maintaining. 4. The 2 sets high resolution CCD camera systems with 50X multiples and 9" monitors enables to visualize and bonding of fine pitch products. 5. With vacuum system for fixing devices 6. Made by Aluminum Alloy. Solid and Modest Specification : - Dimension: 480 x 520 x 520 (mm) - Max. size of bonding blade: 65 x 2.5 (mm) - Cylinder: Dia.32 x 75 (mm) - Timer range: 0.1s ~ 999hrs - Temperature range: Room temperature to 400 degree celsius (stepping) - Heat up time: 100 - 300 degree celsius 5 s - Cool down time: 300 - 100 degree celsius 4 s - Pressure range: 0.15 ~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V/110V 2000W - Max. size of devices can bond: 127mm X 127mm - Weight: 90KG