Detailed Product Description

Application : 1. Bonding of ACF onto TAB, FPC, LCD, or PCB 2. Soldering of FPC or FFC to PCB 3. Bonding of cell phones, electronic translators, PDA, digital cameras, computer monitors, and LCD modules Features : 1. The advanced technology design of automatic sliding in-out function which providing smooth and accurate bonding condition . 2. Precise configuration enhance quality of bonding. 3. The advance programmed stepping temperature system enable fast temperature accelerating and maintaining . 4. With vacuum system for fixing device. 5. Made by Aluminum Alloy. Solid and Modest. Specification : - Dimension: 480 x 470 x 510 (mm) - Max. size of bonding blade: 65 x 2.5 (mm) - Cylinder size: Dia.32 x 75(mm) - Temperature range: Room temperature to 400 degree (stepping) - Timer range: 0.1s ~ 999hrs - Heat up time: 100 - 300 degree celsius 5 s - Cool down time: 300 - 100 degree celsius 4 s - Pressure range: 0.15~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V / 110V 2000W - Max. size of devices can bond: 127mm X 127mm - Weight: 60KG