Detailed Product Description

Application : 1. Bonding of ACF to connect TAB/FPC onto TFT LCD 2. Capable to bond LCD panels size up to 21" Features : 1. The advanced technology design of automatic sliding Left-Right function which providing smooth and accurate bonding condition. 2. Precise configuration enhance quality of bonding. 3. The 2 sets high resolution CCD camera system with 110~240X multiples and 14" monitors enables to visualize and bonding of fine pitch products. 4. With vacuum system for fixing devices. Specification : - Dimension: 1200 x 650 x 800mm - Max. length of bonding blade: 80mm - Cylinder size: Dia.32 x 75 (mm) - Timer range: 0.1s ~ 999hrs - Temperature range: Room temperature to 400 degree celsius - Pressure range : 0.15~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V / 110V 800W - Max. size of devices can bond: 320mm X 427mm - Weight: 150KG