Detailed Product Description

Air compressor type Heat Seal Machine (Enhanced Precision and Efficiency Grade) Application : 1. Bonding of HSC (heat seal connector) to connect LCD and PCB. 2. Bonding of ACF onto TAB, FPC, LCD, or PCB. 3. Bonding of LCD modules, Telephone Sets, LCD games, AV Products, electronic translators, PDA, cell phones, digital cameras, and computer monitors. 4. Ideal for pitches between 0.3mm to 0.7mm Features : 1. The distinctive configuration of 180 degree rotary platform provides smooth and steady process. It enhances efficiency by diminishing the idle time of operators 2. Precise configuration and the advance programmed logic control system enhances quality of bonding 3. The 2 sets high resolution CCD camera systems with 50X multiples and 9" monitors enables to visualize and bonding of fine pitch products. 4. With vacuum system for fixing devices 5. Machine body made by Titanium Alloy, solid and modest Specification : - Dimension: 470 x 540 x 550 (mm) - Max. length of bonding blade: 100mm - Cylinder size: Dia.50 x 75 (mm) - Timer range: 0.1s ~ 999hrs - Temperature range: Room temperature to 400 degree celsius - Pressure range: 0.15 ~ 0.6MPa / 15-60Kgf/cm - Power Supply: AC220V / 110V 1050W - Max. size of bond objects: 120 x 120mm - Options: Monochrome CCD Camera System (CCD camera + Lens + Monitors) - Weight: 80KG